RTA System

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Specifications

The rapid temperature annealing system (RTA) is used for the processing of semiconductor wafers by rapid thermal heating up or annealing from ultra-high vacuum to ambient pressure conditions with different atmospheres like oxygen and nitrogen. Clean, simple and rugged design for compatibility with today's semiconductor processing technologies. Several unique features guarantee excellent uniformity and process reproducibility.

Features:
  • Heat treatement of sample holders
  • Annealing under UHV atmosphere or special gas atomosphere
  • Heating stage with high power, quartz lamps and control unit
  • Adjustable and mobile support frame
  • Gas inlet

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