Sputter-System
Complete UHV sputter-system for the preparation of thin films (metals and dielectrics) on 2" to 4" wafers for various scientific applications.
- True UHV-compatible (achievable base pressure better than 5 x 10-10 mbar in the growth chamber)
- High precision and high quality standard (made in Germany)
- DC and RF sputter sources operated with Ar or O2 (or others)
Technical Data:
Type | RS-SP |
Concept | Load-lock and growth chamber |
Made from | Stainless steel (316 L / 316 LN) |
Sample size | 2 - 4 inch or as specified |
Sputter port number | 8 |
Manipulator | Radiation heating up to 600 °C and LHe cooling |
Cooling | Two shrouds in the area of the substrate and in the area of the sources |
Bakeout temperature | 200°C |
Shipping | Wooden box |
Installation | Included |
Standards:
Growth chamber size | 18 inch or as specified |
Number of sources | 2 x DC, 2 x RF, 2 x Plasmasource, 1 x SFC with pneumatic linear shutters or as specified |
Jalousie | True UHV compatible |
Pumping | TMP (growth and load-lock chamber) or as specified |
Sample transfer | Manual with magnetically coupled trolley |
Bake out system | Included |
Frame | Solid frame made of stainless steel |
Electronics | Stored in an external 19 inch rack |
Options:
- Expandable design for the attachment of further equipment
- Motorisation of transfer and automisation (EMERALT)
- Further effusion cells, plasma sources or e-beam evaporators
- Integration of HP-RHEED (SAFIRE), Ellipsometry or RDS
For further information, please contact
sales(at)createc.de.