RTA-System
The rapid temperature annealing system (RTA) is used for the processing of semiconductor wafers by rapid thermal heating up or annealing from ultra-high vacuum to ambient pressure conditions with different atmospheres like oxygen and nitrogen. Clean, simple and rugged design for compatibility with today's semiconductor processing technologies. Several unique features guarantee excellent uniformity and process reproducibility.
Technical Data:
Type | RTA-CT |
Heating rate | 1 … 100 K/sec |
Temperature range | 100°C … 800°C (optional 1000°C) |
Temperature uniformity | ± 5% (edge excluded) |
Max. wafer size | Up to 4 inch or as specified |
Cooling | Water |
Heating elements | Quartz lamps |
Thermocouple | Type C |
Pressure range | 1000 mbar … 10-9 mbar |
Options:
- Sample rotation
- Magnet (up to 0.2 T - adjustable) with a 210 mm gap
- Pyrometer
- Automisation with EMERALT
Available Downloads:
For further information, please contact
sales(at)createc.de.